S3PM-2017 :: International Convention on

Shape, Solid, Structure, & Physical Modeling

Design, Modeling, Representation, Processing, Analysis, and Visualization of Shapes, Solids, Structures, Materials, Properties, and Behaviors.

Shape Modeling International (SMI)

The Shape Modeling International (SMI-2017) Symposium will be co-located with Symposium on Solid and Physical Modeling (SPM2017) as part of the International Convention on Shape, Solid, Structure, & Physical Modeling (S3PM-2017) in Berkeley, California.

SMI is the premier international forum for the dissemination of new mathematical theories and novel computational techniques for modeling, simulating, and processing digital shape representations. SMI gathers a wide community of researchers, developers, practitioners, and students in academia and industry.

Conference proceedings will be published in a special issue of the Journal of Computers & Graphics (Elsevier) after a rigorous two-stage review process.

More information on topics, paper format, submission guidelines, and important dates are given below.

SMI-2017 :: Submitting a Paper

  Topics

We invite submissions related to, but not limited to, the following topics:

  • Acquisition and reconstruction
  • Behavior and animation models
  • Compression and streaming
  • Computational topology
  • Correspondence and registration
  • Curves and surfaces
  • Deep learning techniques for shape processing
  • Digital Fabrication, and 3D Printing
  • Exploration of shape collections
  • Healing and resampling
  • Implicit surfaces
  • Interactive modeling, design, and editing
  • Medial and skeletal representations
  • Parametric and procedural models
  • Semantics of shapes
  • Shape analysis and retrieval
  • Shape modeling applications (biomedical, GIS, artistic/cultural and others)
  • Shape statistics
  • Shape transformation, bending, and deformation
  • Sketching and 3D input modalities
  • Triangle and polygonal meshes


  Paper Format

Submissions should be formatted according to the style guidelines for Computers & Graphics (Elsevier) and should not exceed 12 pages, including figures and references, since all accepted papers will appear in a special issue of the said journal.

We strongly recommend using the LaTeX template to format your paper. But we also accept papers formatted by MS Word according to the style guidelines for Computers & Graphics (Elsevier). The file must be submitted in PDF format for the first round of submission.

Please refer to the Computers & Graphics Guide for Authors for format details and LaTeX instructions/template.

Double-Blind Review: The SMI-2017 conference will use a double-blind review process. Consequently, all submissions must be anonymous.


  Submission

Abstracts: An abstract should be submitted to the Abstract Submission Form before Tuesday, March 28th at 23:59 UTC/GMT.

Full Papers: All papers (maximum 12 pages) should be submitted directly via the journal Online Submission System of Computers & Graphics (Elsevier) before Monday, April 3rd at 23:59 UTC/GMT.

Note: When submitting your paper to SMI-2017, please make sure that the type of article is specified as "SI: SMI 2017".

Peer-reviewed papers should present previously unpublished, original results that are not simultaneously submitted elsewhere.

All submission will be rigorously peer-reviewed by members of the international program committee. All accepted papers will be published in the journal of Computers & Graphics (Elsevier).

Any accepted paper is required to have at least one author or qualified proxy to attend and present the paper at the conference.

If you have any technical problems on paper submission, please contact the Program Chairs for inquiry.


  Important Dates (Deadlines @ 23:59 UTC/GMT)

  Mar 28, 2017 :: Abstract Submission Due

  Apr 03, 2017 :: Full Paper Submission Due

  Apr 23, 2017 :: First Review Notification

  May 08, 2017 :: Revised Paper Submission Due

  May 15, 2017 :: Second Review Notification

  May 20, 2017 :: Final Paper Submission Due

  Jun 21-23, 2017 :: Symposium @ UC Berkeley


  Questions?

If you have any questions or suggestions, do not hesitate to contact us at s3pm@icsi.berkeley.edu.

SPM-2017 :: Submitting a Poster

  Submission

SMI-2017 will have a joint poster session with SPM-2017 and will accept proposals for posters in the form of abstracts. An abstract should be submitted to the Poster Submission Form before Friday, May 5th at 23:59 UTC/GMT.


  Poster Format

The abstracts should contain the title, the names/affiliations/URLs of the authors, and a brief (at most 400 words) outline of the problem discussed and of the contribution presented.

The display information and specifications (e.g., poster size) will be communicated along with the acceptance notifications to the authors.


  Important Dates (Deadlines @ 23:59 UTC/GMT)

  May 05, 2017 :: Poster Abstracts Due

  May 12, 2017 :: Notification of Poster Acceptance


  Questions?

If you have any questions or suggestions, do not hesitate to contact us at s3pm@icsi.berkeley.edu.

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S3PM/SMI Chairs

Feel free to contact us for inquieries!

Vadim Shapiro

Univ. of Wisconsin-Madison & ICSI


S3PM
Convention Chair


Jarek Rossignac

Georgia Tech


SMI
Conference Chair


SMI Program Chairs

Feel free to contact us for inquieries!

Marco Attene

CNR Genova


SMI
Program Chair


Sylvain Lefebvre

Inria


SMI
Program Chair


Daniele Panozzo

New York Univ.


SMI
Program Chair



International Program Committee

Valery Adzhiev,Bournemouth University
Ergun Akleman,Texas A&M University
Marc Alexa,Technical University of Berlin
Alexander Belyaev,Heriot-Watt University
Silvia Biasotti,IMATI-CNR
David Bommes,RWTH Aachen University
Mario Botsch,Bielefeld University
Michael Bronstein,Università della Svizzera Italiana
Marcel Campen,New York University
Nathan Carr,Adobe Systems
Raphaelle Chaine,University of Lyon
Paolo Cignoni,Institute for Computer Science and Technologies
Daniel Cohen-Or,Tel Aviv University
David Cohen-Steiner,INRIA
Cyril Crassin,NVidia
Mathieu Desbrun,California Institute of Technology
Tamal Dey,Ohio State University
Olga Diamanti,Stanford University
Gershon Elber,Technion - Israel Institute of Technology
Leila De Floriani,Universiy of Maryland
Hongbo Fu,City University of Hong Kong
Eric Galin,University of Lyon
Yotam Gingold,George Mason University
Stefanie Hahmann,Grenoble Institute of Technology
John Hart,University of Illinois at Urbana-Champaign
Kristian Hildebrand,Beuth University
Shi-Min Hu,Tsinghua University
Ioannis Ivrissimtzis,Durham University
Wenzel Jakob,EPFL
Joaquim Jorge,Technical University of Lisbon
Bert Juettler,Johannes Kepler University
Vangelis Kalogerakis,University of Massachusetts at Amherst
Misha Kazhdan,Johns Hopkins University
John Keyser,Texas A&M University
Ron Kimmel,Technion - Israel Institute of Technology
Leif Kobbelt,RWTH Aachen University
Shahar Kovalsky,Duke University
David Levin,University of Toronto
Bruno Levy,INRIA
Hao Li,Industrial Light & Magic
Xin Li,Louisiana State University
Jyh-Ming Lien,George Mason University
Peter Lindstrom,Lawrence Livermore National Laboratory
Yaron Lipman,Weizmann Institute of Science
Ligang Liu,University of Science and Technology of China
Niloy Mitra,University College London
Ahmad Nasri,Lebanese National Council for Scientific Research
Matthias Niessner,Stanford University
Alexander Pasko,Bournemouth University
Giuseppe Patane,IMATI-CNR
Fabrizio Pece,ETH Zurick
Jorg Peters,University of Florida
Nico Pietroni,ISTI-CNR
Konrad Polthier,Freie Universit Berlin
Roi Poranne,ETH Zurick
Hong Qin,Stony Brook University
Raif Rustamov,Stanford University
Michael Scott,Brigham Young University
Carlo Sequin,University of California, Berkely
Alla Sheffer,University of British Columbia
Michela Spagnuolo,IMATI-CNR
Chengcheng Tang,Stanford University
Marco Tarini,Università degli Studi dell'Insubria, ISTI-CNR
Gabriel Taubin,Brown University
Daniel Thalmann,EPFL
Yiying Tong,Michigan State University
Amir Vaxman,Utrecht University
Remco Veltkamp,Utrecht University
Etienne Vouga,University of Texas at Austin
Michael Wand,MPII Saarbrucken
Wenping Wang,University of Hong Kong
Michael Wimmer,Vienna University of Technology
Brian Wyvill,University of Bath
Geoff Wyvill,University of Otago
Eugene Zhang,Oregon State University
Kun Zhou,Zhejiang University
Denis Zorin,New York University
  Previous Conferences

Sponsors & Partners

Interested in becoming a sponsor? Get in touch

So far, we have five financial sponsors supporting S3PM: Autodesk (Gold), Siemens (Gold), PARC (Gold), University of Wisconsin (Gold), and Elsevier (Silver).


The SMI-2017 is held "in-cooperation" with ACM/SIGGRAPH and EuroGraphics. ACM and EG members will benefit from special discounts for registration.


The S3PM-2017 is hosted by the International Computer Science Institute (ICSI), a leading independent, nonprofit center for research in computer science.