S3PM-2017 :: International Convention on

Shape, Solid, Structure, & Physical Modeling

Design, Modeling, Representation, Processing, Analysis, and Visualization of Shapes, Solids, Structures, Materials, Properties, and Behaviors.

Solid and Physical Modeling (SPM)

Call for Papers

The Symposium on Solid and Physical Modeling (SPM-2017) will be co-located with Shape Modeling International (SMI-2017) Symposium as part of the International Convention on Shape, Solid, Structure, & Physical Modeling (S3PM-2017) in Berkeley, California.

SPM seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas. The symposium is organized with the support of the Solid Modeling Association (SMA), which will award the 2017 Pierre Bézier Prize for contributions to solid, shape, and physical modeling during the conference.

Accepted full-length papers will be published in a special issue of the Journal of Computer-Aided Design (Elsevier) after a rigorous double-blind review process.

More information on topics, paper format, submission guidelines, and important dates are given below.

SPM-2017 :: Submitting a Paper

  Topics

We invite submissions related to, but not limited to, the following topics:

  • 3D fabrication/printing/manufacturing technologies
  • Anisotropic/heterogeneous/composite materials
  • Applied algebraic and differential geometry
  • Applied computational geometry and topology
  • Conceptual, collaborative, and distributed design
  • Computational fabrication
  • Curve, surface, and manifold modeling
  • Dimensioning and tolerancing
  • Feature modeling, recognition, and understanding
  • Geometric algorithms
  • Geometric and topological representations
  • Geometric constraint solving and parametric modeling
  • Geometric interpolation and smoothing
  • Geometry generation and processing
  • Geometry compression and transmission
  • Isogeometric and finite element analysis
  • Meshing and mesh optimization
  • Multi-resolution modeling
  • Numerical analysis of geometric algorithms
  • Physically-based modeling and simulation
  • Product data exchange, standards, and interoperability
  • Reverse engineering/reconstruction of surfaces/solids
  • Robustness and validity of geometric computations
  • Shape modeling, synthesis, and analysis


  Paper Format

Submission should be formatted according to the style guidelines for Computer-Aided Design (Elsevier) and should not exceed 12 pages, including figure and references, since all accepted papers will appear in a special issue of the said journal.

We strongly recommend using the LaTeX template to format your paper, but we also accept papers formatted by MS Word according to the style guidelines for Computer-Aided Design (Elsevier). The file must be submitted in PDF format for the first round of submission.

Please refer to the Computer-Aided Design Guide for Authors for format details and LaTeX instructions/template.

Note: Authors who choose to use LaTeX (strongly recommended) should format their papers in accordance with the 'elsarticle' instructions. The 'elsarticle' class has several options associated with it. Authors should utilize the "[5p,twocolumn]" option.

Double-Blind Review: The SPM-2017 conference will use a double-blind review process. Consequently, all submissions must be anonymous.


  Submission

Abstracts: An abstract should be submitted to the EasyChair System. The abstract should contain the title and one paragraph explaining the main idea of the paper. It will help the paper chairs assign the reviewers.

Full Papers: All papers (suggested length 10-12 pages, maximum 12 pages) should be submitted to the EasyChair System before Friday, February 24th March 3rd at 23:59 UTC/GMT.

Peer-reviewed papers should present previously unpublished, original results that are not simultaneously submitted elsewhere.

All submission will be rigorously peer-reviewed by members of the international program committee. All accepted papers will be published in the journal of Computer-Aided Design (Elsevier).

Any accepted paper is required to have at least one author or qualified proxy to attend and present the paper at the conference.

If you have any technical problems on paper submission, please contact the Program Chairs for inquiry.


  Important Dates (Deadlines @ 23:59 UTC/GMT)

  Feb 24, 2017 :: Full Paper Submission Due

  Mar 03, 2017 :: Full Paper Submission Due (Extended)

  Apr 07, 2017 :: First Review Notification

  Apr 21, 2017 :: Revised Paper Submission Due

  Apr 28, 2017 :: Final Notification of Acceptance

  May 05, 2017 :: Camera-Ready Full Papers Due

  Jun 19-21, 2017 :: Symposium @ UC Berkeley


  Questions?

If you have any questions or suggestions, do not hesitate to contact us at s3pm@icsi.berkeley.edu.

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S3PM/SPM Chairs

Feel free to contact us for inquieries!

Vadim Shapiro

Univ. of Wisconsin-Madison & ICSI


S3PM
Convention Chair


Sara McMains

Univ. of California, Berkeley


SPM
Conference Chair


SPM Program Chairs

Feel free to contact us for inquieries!

Mario Botsch

Bielefeld Univ.


SPM
Program Chair


Stefanie Hahmann

Univ. of Grenoble Alpes & INRIA


SPM
Program Chair


Jessica Zhang

Carnegie Mellon Univ.


SPM
Program Chair



International Program Committee

Nina Amenta,University of California, Davis
Cecil Armstrong,Queen's University Belfast
Chandrajit Bajaj,University of Texas at Austin
Michael Barton,Basque Center for Applied Mathematics
Carolina Beccari,Università di Bologna
Dominique Bechmann,Université de Strasbourg
Dobrina Boltcheva,Inria Nancy
Georges-Pierre Bonneau,Grenoble Universités
Wim Bronsvoort,Delft University of Technology
Frédéric Cazals,Inria Sophia Antipolis
Raphaelle Chaine,University of Lyon
Elaine Cohen,University of Utah
Frédéric Cordier,Université de Haute
Chongyang Deng,Hangzhou Dianzi University
Jiansong Deng,University of Science and Technology of China
Tamal Dey,Ohio State University
Tor Dokken,SINTEF
Gershon Elber,Technion
Rida Farouki,University of California, Davis
Anath Fischer,Technion - Israel Institute of Technology
Shuming Gao,Zhejiang University
Andrew Gillette,University of Arizona
Dan Gonsor,Boeing
Craig Gotsman,Technion - Israel Institute of Technology
Xiaohu Guo,University of Texas at Dallas
David Xianfeng Gu,Stony Brook University
Dianne Hansford,Arizona State University
John Hart,University of Illinois at Urbana-Champaign
Ying He,Nanyang Technological University
Martin Hering-Bertram,Bremen University of Applied Sciences
Chris Hoffmann,Purdue University
Kai Hormann,Università della Svizzera italiana
Shi-Min Hu,Tsinghua University
Zhangjin Huang,University of Science and Technology of China
Insung Ihm,Sogang University
Horea Ilies,University of Connecticut
Ravi Janardan,University of Minnesota
Robert Joan-Arinyo,Universitat Politecnica de Catalunya
Leo Joskowicz,Hebrew University of Jerusalem
Tao Ju,Washington University at St. Louis
Bert Jüttler,Johannes Kepler Universität
John Keyser,Texas A&M University
Deok-Soo Kim,Hanyang University
Myung-Soo Kim,Seoul National University
Tae-Wan Kim,Seoul National University
Young Kim,Ewha University
Leif Kobbelt,RWTH Aachen
Adarsh Krishnamurthy,Iowa State University
Yu-Kun Lai,Cardiff University
Jean-Claude Leon,Grenoble Institute of Technology
Bruno Lévy,Inria Nancy
Xin Li,Louisiana State University
Jyh-Ming Lien,George Mason University
Hongwei Lin,Zhejiang University
Ming Lin,University of North Carolina
Yaron Lipman,Weizmann Institute of Science
Ligang Liu,University of Science and Technology of China
Yong-Jin Liu,Tsinghua University
Weiyin Ma City,University of Hong Kong
Takashi Maekawa,Yokohama National University
Stephen Mann,University of Waterloo
Dinesh Manocha,University of North Carolina
Josiah Manson,Activision
Sara McMains,University of California, Berkeley
Niloy Mitra,University College London
Géraldine Morin,University of Toulouse
Saigopal Nelaturi,PARC
Daniele Panozzo,New York University
Jorg Peters,University of Florida
Konrad Polthier,Freie Universität Berlin
Xiaoping Qian,Illinois Institute of Technology
Hong Qin,Stony Brook University
Bill Regli,Drexel University
Richard Riesenfeld,University of Utah
Damien Rohmer,CPE Lyon
Lucia Romani,University of Milano-Bicocca
Jarek Rossignac,Georgia Institute of Technology
Nickolas Sapidis,University of Western Macedonia
Scott Schaefer,Texas A&M University
Vadim Shapiro,University of Wisconsin-Madison
Kai Tang,Hong Kong University of Science and Technology
Yiying Tong,Michigan State University
Georg Umlauf,Hochschule Konstanz University of Applied Sciences
Charlie Wang,Delft University of Technology
Jun Wang,Nanjing University of Aeronautics and Astronautics
Wenping Wang,Hong Kong University
Zhouwang Yang,University of Science and Technology of China
Jianmin Zheng,Nanyang Technological University
  Previous Conferences

Sponsors & Partners

Interested in becoming a sponsor? Get in touch

So far, we have five financial sponsors supporting S3PM: Autodesk (Gold), Siemens (Gold), PARC (Gold), University of Wisconsin (Gold), and Elsevier (Silver).


The SPM-2017 is held "in-cooperation" with ACM/SIGGRAPH and EuroGraphics. ACM and EG members will benefit from special discounts for registration.