S3PM-2017 :: International Convention on

Shape, Solid, Structure, & Physical Modeling

Design, Modeling, Representation, Processing, Analysis, and Visualization of Shapes, Solids, Structures, Materials, Properties, and Behaviors.

Fabrication and Sculpting Event (FASE)

The Fabrication and Sculpting Event (FASE-2017) will be co-located with Symposium on Solid and Physical Modeling (SPM2017) and Shape Modeling International (SMI-2017) Symposium as part of the International Convention on Shape, Solid, Structure, & Physical Modeling (S3PM-2017) in Berkeley, California.

FASE presents original research at the intersection of theory and practice in shape modeling, fabrication and sculpting. FASE focuses on the practical problems of generating shapes and specifically addresses the interplay of theory and practice. FASE invites practitioners who have inspiring ideas to contribute their work concerned with techniques to design, sculpt and fabricate shapes.

Accepted FASE papers will be published in a special issue of the Hyperseeing (ISAMA) magazine after a one-stage review process.

More information on topics, paper format, submission guidelines, and important dates are given below.

FASE-2017 :: Submitting a Paper

  Topics

FASE solicits papers that pose new questions and motivate further research in designing, fabrication and sculpting. Topics should be useful, for example, in the following areas:

  • Fabrication of digital models
  • Advanced manufacturing techniques such as additive manufacturing, laser cutting or CNC milling
  • Interactive or procedural design of manufacturable shapes
  • Interconnections of complex modeling and fabrication processes
  • Visually stimulating fabrication techniques techniques or printed structures


  Paper Format

Submissions should be formatted according to the formatting guidelines for Bridges - Math, Art and Science Conference. Both LaTeX and MS Word styles are available at Bridges Paper Formatting Guidelines.

We strongly recommend using the LaTeX template to format your paper, but we also accept papers formatted by MS Word according to the style guidelines for Bridges - Math, Art and Science Conference. The file must be submitted in PDF format for the first round of submission.

Full Papers: There is no page limit for Full Papers. Please make sure that the number of pages are even and the width of all figures are the same as the width of the text.

Short Papers: For short papers, the limit is 6 pages and short papers will be presented in the conference as posters.

Single-Blind Review: In FASE-2017, all decisions will be made through a single-blind review process. Therefore all submissions must be anonymous.


  Submission

FASE invites practitioners who have inspiring ideas to contribute their work concerned with techniques to design, sculpt and fabricate shapes. The work is expected to have clear algorithmic or mathematical aspects.

All FASE paper submissions (including full and short papers) will be handled via the EasyChair System, following a one-stage peer review cycle.

Accepted FASE papers will be published in a special issue of the Hyperseeing magazine.

FASE paper presentations will be 15 minutes in length and typically be presented in sessions held in parallel to technical paper presentations at the S3PM-2017.

If you have any technical problems on paper submission, please contact the Program Chairs for inquiry.


  Important Dates (Deadlines @ 23:59 UTC/GMT)

  May 15, 2017 :: Full Paper Submission Due

  May 30, 2017 :: Acceptance Notification

  Jun 10, 2017 :: Camera Ready Papers Due

  Jun 21-23, 2017 :: Event @ UC Berkeley



  Previous Events


  Questions?

If you have any questions or suggestions, do not hesitate to contact us at s3pm@icsi.berkeley.edu.

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FASE Event Chairs

Feel free to contact us for inquieries!

Ergun Akleman

Texas A&M Univ.


FASE
Event Co-Chair


Jakob Andreas Bærentzen

Technical Univ. of Denmark


FASE
Event Co-Chair


Konrad Polthier

Freie Univ. Berlin


FASE
Event Co-Chair



Sponsors & Partners

Interested in becoming a sponsor? Get in touch

So far, we have five financial sponsors supporting S3PM: Autodesk (Gold), Siemens (Gold), PARC (Gold), University of Wisconsin (Gold), and Elsevier (Silver).


Both SPM & SMI are held "in-cooperation" with ACM/SIGGRAPH and EuroGraphics. ACM and EG members will benefit from special discounts for registration.


The National Science Foundation (NSF) is providing travel funding for supporting student attendees.

The S3PM-2017 is hosted by the International Computer Science Institute (ICSI), a leading independent, nonprofit center for research in computer science.