S3PM-2017 :: International Convention on

Shape, Solid, Structure, & Physical Modeling

Design, Modeling, Representation, Processing, Analysis, and Visualization of Shapes, Solids, Structures, Materials, Properties, and Behaviors.

For Five Days,
discuss the research frontiers of Shape, Solid, Structure, & Physical Modeling (S3PM).

S3PM primarily focuses on the mathematical & algorithmic principles, as well as practical tools, for the design, modeling, representation, processing, analysis, and visualization of shapes, solids, structures, materials, properties, and behaviors.

S3PM-2017 will combine the two prime conferences in this area: (1) the Symposium on Solid and Physical Modeling (SPM); and (2) the Shape Modeling International (SMI) Symposium. It will also Include the Fabrication and Sculpting Event (FASE), the Pierre Bézier Award Ceremony held by the Solid Modeling Association (SMA), keynote speakers of international reputation, industry panels, and several mini-symposia on important cutting-edge topics and research directions.

More details about the conference events, venue, agenda, speakers, and other logistics will be announced later.













S3PM Symposia

Two consecutive co-located symposia

Solid and Physical Modeling (SPM-2017)

Symposium: June 19th to 21st, 2017

The ACM Symposium on "Solid Modeling and Applications (SMA)," SPM has been the primary venue for disseminating research results in the design, representation, analysis, visualization, and use of digital models of real or planned solid objects and of their bounding surfaces. Its initial focus was on the theoretical and algorithmic tools that produce and exploit unambiguous representations of the geometry of such objects. Its broadening to "Solid and Physical Modeling (SPM)" extended the focus from solids to also include models of their internal structures, physical properties, and behaviors.

Deadlines: February 18th (abstract), March 3rd (full papers), 2017

CLICK for more info & submission guidelines

Shape Modeling International (SMI-2017)

Symposium: June 21st to 23rd, 2017

The "Shape Modeling International (SMI)" Symposium is the premier international forum for the dissemination of new mathematical theories and novel computational techniques for modeling, simulating, and processing digital shape representations. SMI gathers a wide community of researchers, developers, practitioners, and students in academia and industry. Conference proceedings will be published in a special issue of the Computer & Graphics Journal after a rigorous two-stage review process.

Deadlines: March 28th (abstract), April 3rd (full papers), 2017

CLICK for more info & submission guidelines

Additional Events

Fabrication and Sculpting Event (FASE)

Event: June 21st to 23rd, 2017

The "Fabrication and Sculpting Event (FASE)" presents original research at the intersection of theory and practice in shape modeling, fabrication and sculpting. FASE focuses on the practical problems of generating shapes and specifically addresses the interplay of theory and practice. FASE invites practitioners who have inspiring ideas to contribute their work concerned with techniques to design, sculpt and fabricate shapes. The work is expected to have clear algorithmic or mathematical aspects.

Deadline: April 24th (full papers), 2017

CLICK for more info & submission guidelines

S3PM :: Call for Mini-Symposia Proposals:

The Chairs of the Convention are inviting proposals for a small number of Mini-Symposia focused on emerging topics of high impact on the research and industrial communities.

We are inviting you to consider submitting a proposal and chairing it, if accepted. A mini-symposium will include 3 presentations (20 mins each) by the Chair and 2 invited speakers, or a brief introduction by the Chair and presentations by 3 invited speakers, followed by a panel and Q&A discussion.

The proposal should be submitted before April 15, 2017 to s3pm@icsi.berkeley.edu. Feel free to contact us using the same e-mail address for any questions.

Each proposal should include: (1) title of the mini-symposium,(2) name, affiliation, and homepage link of the Chair, (3) list of speakers’ names with their affiliations and homepage links, and (4) brief outline and motivation for the importance of the topic.

For each presentation, the proposal should include: (1) title of the presentation, (2) speaker’s name, (3) short abstract (about 200 words), and (4) link to the most relevant paper.

Bézier Award 2017 :: Call for Nominations:

Sponsored by the Solid Modeling Association (SMA) and the Symposium on Solid and Physical Modeling (SPM).

With the approval of the family of the late Pierre Bézier, the Solid Modeling Association established in 2007 the Pierre Bézier Award for contributions in Solid, Geometric and Physical Modeling and for their Applications. Pierre Bézier was one of the founders of these fields. Beginning with his work on representing curves, and continuing through his work on one of the first CAD/CAM systems at Renault (UNISURF), Pierre Bézier led the transformation of design and manufacturing, through mathematics and computing tools, into computer aided design and three dimensional modeling. He made contributions to computer control, interactive free-form curve and surface design and 3D milling for manufacturing clay models and masters. Bézier's approach to research exemplifies how the problems from the real world can drive scientific inquiry and lead to engineering accomplishments.

Solid, geometric and physical modeling have matured and have come a long way since the 1950s, resulting in a rich set of theories, mathematics and algorithms that define and manipulate representations of physical objects, their properties, and their associated abstractions. These representations are intimately tied to processes (such as simulation, design, manufacturing, and analysis) and application domains (automotive, aerospace, bio-medical, graphic arts, etc). These representations support the creation, exchange, simulation, visualization, animation, interrogation, and annotation of the digital models of the objects and their evolution.

CLICK HERE to see previous recepients of the Bézier Award, nomination process and timeline, and other details.

The Pierre Bézier Award and the acceptance lecture will be presented at the SPM-2017 Symposium on June 19-21.

Conference Schedule

Contributed Talks, Mini-Symposia, & Other Events

The conference agenda will be announced later.

The conference agenda will be announced later.

The conference agenda will be announced later.

The conference agenda will be announced later.

The conference agenda will be announced later.

Location and Venue

Great Lodging, Great Food, & Magnificent Sights

"Vibrant. Dynamic. Cutting edge. The San Francisco Bay Area is a global hub of commerce, innovation, culture and recreation. UC Berkeley sits in the East Bay region with easy access to both San Francisco and Silicon Valley, and a few hours from Yosemite, Napa Valley, Point Reyes and Lake Tahoe. When visiting UC Berkeley, we encourage you to explore the area, hike in the hills, indulge in the California food scene and enjoy the culture and optimism of one of the most desirable areas in the world."

  Convention Venue

University of California, Berkeley

Detailed directions and building address TBA.

Berkeley, CA 94720, USA

Directions on Google Maps

  Reserved Lodging

Lodging information will be announced later.

  Berkeley highlights

  Beyond Berkeley

  San Fransisco

Less than one hour away via Bay Area Rapid Transport (BART)!

Enumerating SF attractions wouldn't fit into this narrow section...
See this video review by New York Times.

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Convention Organizers

See SPM, SMI, and FASE webpages for Program Chairs

Vadim Shapiro

Univ. of Wisconsin-Madison & ICSI

Convention Chair

Sara McMains

Univ. of California, Berkeley

Conference Chair

Jarek Rossignac

Georgia Tech

Conference Chair

Leah Hitchcock


Local Arrangements Chair

Morad Behandish


Publicity Chair

Sponsors & Partners

Interested in becoming a sponsor? Get in touch

So far, we have five financial sponsors supporting S3PM: Autodesk (Gold), Siemens (Gold), PARC (Gold), University of Wisconsin (Gold), and Elsevier (Silver).

The S3PM-2017 is held "in-cooperation" with ACM/SIGGRAPH and EuroGraphics. ACM and EG members will benefit from special discounts for registration.